Science and Engineering: Innovation, Research, Education and Economics
February 15, 2007
IBM Believes New DRAM will Double Performance

IBM drives road to denser CPU memory

By combining techniques in process and circuit design, IBM believes it can put as much as 48 Mbytes of fast DRAM on a reasonably sized CPU when its 45nm technology becomes available in 2008.

BM combined two advances to enable the new memory integration. The company found a way to migrate its deep trench technology used for DRAMs from CMOS to its silicon-on-insulator (SOI) logic process. In a paper last December, IBM described that work that involved suppressing the floating-body effect in SOI.

Related: IBM touts faster on-chip memory breakthrough - More Microchip Breakthroughs - 3 “Moore Generations” of Chips at Once - Engine on a Chip Battery - Using Light to Transmit Data

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