By combining techniques in process and circuit design, IBM believes it can put as much as 48 Mbytes of fast DRAM on a reasonably sized CPU when its 45nm technology becomes available in 2008.
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BM combined two advances to enable the new memory integration. The company found a way to migrate its deep trench technology used for DRAMs from CMOS to its silicon-on-insulator (SOI) logic process. In a paper last December, IBM described that work that involved suppressing the floating-body effect in SOI.